Vertiv has opened a customer experience centre in Singapore to demonstrate how integrated power, cooling and other infrastructure technologies can support artificial intelligence (AI), high-performance computing (HPC) and high-density data centres. The Vertiv Experience Center Singapore gives customers, channel partners, consultants and other industry stakeholders hands-on access to the company’s power, cooling, integrated infrastructure and services portfolio. Live displays across the site include prefabricated overhead infrastructure, intelligent modular data centre systems, liquid cooling equipment, critical power technologies and monitoring capabilities.
Integrating power, cooling and networking
Featured among the exhibits is a prefabricated overhead infrastructure system that integrates power distribution, liquid cooling piping, networking and busway into a single scalable platform. The installation enables visitors to examine how these components are arranged to support high-density computing environments.
The facility also features the latest generation of intelligent modular data centre infrastructure, alongside advanced thermal management, power management and monitoring technologies designed for high-density AI applications. Vertiv is using the exhibits to demonstrate how its systems can work together across the infrastructure supporting computing environments, from the utility grid to the chip. According to the company, AI workloads are increasing power density and cooling demands, creating additional requirements for integrated infrastructure that can support scalable, energy-efficient and resilient computing environments.
“Organisations across Asia are scaling their digital infrastructure to support AI innovation, creating new demands for reliability, efficiency and speed of deployment,” said Antony Szafranek, Senior Director for Strategic Accounts at Vertiv Asia. “The Experience Center gives customers and partners a hands-on environment to explore how integrated power and cooling technologies can support higher-density computing while maintaining operational resilience.”
Demonstrating cooling and power management
Liquid cooling technologies displayed at the centre include solutions for direct-to-chip cooling and other high-density applications, appearing alongside additional thermal management technologies designed to support AI computing. These exhibits give visitors access to different parts of Vertiv’s cooling portfolio, while electrical displays cover critical power systems, switchgear and power distribution technologies intended for increasingly demanding workloads. Power management technologies are also featured, allowing visitors to examine the electrical systems alongside the cooling technologies presented at the centre.
Infrastructure management and monitoring systems form another part of the demonstrations. Vertiv says these capabilities are intended to improve visibility and operational control, complementing the power and cooling technologies used in high-density computing environments.
Daniel Sim, Senior Director for AI Ecosystem Alliances and Channel Partners at Vertiv Asia, said the pace of AI-driven transformation requires greater integration of power, cooling and IT infrastructure. He added that the centre enables customers to see how those technologies work together to address AI and high-density computing requirements.
