
MediaTek unveils Dimensity 9600 Pro with TSMC’s 2nm process
MediaTek’s Dimensity 9600 Pro brings TSMC’s 2nm process, faster performance, improved efficiency and advanced on-device AI to flagship phones.

MediaTek’s Dimensity 9600 Pro brings TSMC’s 2nm process, faster performance, improved efficiency and advanced on-device AI to flagship phones.

The Boox Palma 3 combines Android 16, a premium aluminium-and-fibreglass design, stylus support, and a 16MP camera in a compact ereader.

iFi's Go Cable combines a hi-res DAC and headphone amp in a USB-C cable for IEMs, with gaming and microphone support.
Google Pixel 11 Pro Fold brings a lighter design, bright 8-inch display, Tensor G6 performance, capable cameras and faster Pixelsnap charging.

EU energy labels reveal a larger iPhone 18 Pro Max battery, while the US model reportedly uses a Qualcomm modem.

Motorola teases a compact book-style foldable Razr, hinting at a wider display and a new direction for its folding phone range.

Apple’s first foldable iPhone could be called Duo, start at US$2,000 and feature a new chip, dual cameras and Apple Pencil support.

POCO has introduced the F9 series in Singapore, combining Snapdragon 8 Elite Gen 5 performance, Bose audio, 185Hz displays and dedicated gaming silicon.

Poco's F9 Ultra pairs a flagship Snapdragon chip with a 185Hz AMOLED display, 8,050mAh battery and 200MP camera.