Siemens and TSMC bring AI agents into semiconductor design checks
Siemens expands its EDA partnership with TSMC, using intelligent agents to verify complex 3D chip layouts and streamline advanced semiconductor manufacturing.
Siemens expands its EDA partnership with TSMC, using intelligent agents to verify complex 3D chip layouts and streamline advanced semiconductor manufacturing.

MediaTek’s Dimensity 9600 Pro brings TSMC’s 2nm process, faster performance, improved efficiency and advanced on-device AI to flagship phones.

Samsung and TSMC will adopt ASML’s High NA EUV technology, while larger photomasks could improve chipmaking efficiency and costs.

Sony and TSMC are partnering in Japan to develop advanced image sensors for smartphones, vehicles, and cameras.

Tokyo Electron faces scrutiny after a former employee was arrested in Taiwan for allegedly stealing TSMC trade secrets.
AMD and TSMC mark industry first with Venice processor on 2nm process and validate EPYC chips at Arizona fab.

Broadcom and TSMC are reportedly exploring deals to acquire parts of Intel, with potential concerns over foreign control of US chip factories.

NXP and VIS plan to expand their US$7.8 billion Singapore venture to strengthen global chip production amid rising US-China tensions.

Apple’s M5 chip will use TSMC’s advanced 3nm process and debut in late 2025, likely in the iPad Pro, MacBook Pro, and Vision Pro…