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NVIDIA unveils first US-made Blackwell wafer as domestic chip production expands

NVIDIA unveils its first US-made Blackwell wafer at TSMC’s Arizona facility, marking a major milestone in domestic AI chip production.

NVIDIA has reached a significant milestone in its effort to boost domestic semiconductor manufacturing, showcasing the first Blackwell wafer produced in the United States. The wafer, which serves as the foundation for the company’s advanced AI chips, was assembled at Taiwan Semiconductor Manufacturing Company’s (TSMC) facility in Phoenix, Arizona.

Strengthening local chip production

The achievement marks a significant moment in NVIDIA’s journey to enhance its local supply chain and reduce reliance on overseas manufacturing. The company’s collaboration with TSMC’s Arizona plant demonstrates progress towards diversifying production amid global semiconductor challenges and ongoing geopolitical tensions.

NVIDIA first unveiled its Blackwell platform last year, positioning it as the next leap in AI technology. The platform has already attracted commitments from major tech firms, including Amazon, Google and OpenAI. Designed to deliver powerful computing performance with exceptional efficiency, the Blackwell architecture reportedly offers up to 25 times lower cost and energy consumption compared to its predecessor.

By manufacturing Blackwell wafers within the United States, NVIDIA gains a strategic advantage against fluctuating tariffs and potential supply disruptions. The development also aligns with broader national goals to revitalise domestic chip production and reduce dependency on foreign fabrication plants.

A milestone moment for US semiconductor manufacturing

At a celebration marking the unveiling, NVIDIA’s founder and CEO, Jensen Huang, emphasised the importance of this achievement in the context of American manufacturing. “It’s the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC, here in the United States,” Huang said.

This marks the first instance in decades that such a critical piece of high-performance computing technology is being produced domestically. The event in Arizona not only celebrated a technological achievement but also highlighted the deepening collaboration between NVIDIA and TSMC in pushing the boundaries of chip innovation.

Huang has been vocal about the need for a resilient and distributed supply chain to support the rapid expansion of artificial intelligence infrastructure worldwide. By investing in American manufacturing, NVIDIA aims to ensure a more stable and secure source of chips as demand for AI computing continues to soar.

Expanding investment in US-based AI infrastructure

Beyond the production of Blackwell wafers, NVIDIA has outlined ambitious plans to expand its manufacturing and infrastructure footprint across the country. Earlier this year, the company announced its intention to invest as much as US$500 billion in building AI infrastructure within the United States. This massive investment will involve partnerships with TSMC, Foxconn and other technology firms.

The plan underscores NVIDIA’s commitment to supporting America’s growing role in the global semiconductor landscape. With AI adoption accelerating across industries—from data centres to autonomous vehicles—NVIDIA’s investment is expected to help build the technological backbone needed to sustain this growth.

As the Blackwell architecture moves into large-scale production, the Arizona-made wafer symbolises both technological progress and a renewed confidence in US-based chip fabrication. It stands as a testament to how global collaboration, strategic investment and innovation can converge to strengthen the future of computing.

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