Apple is set to work with Samsung to manufacture advanced digital image sensors for upcoming iPhone models, according to a report by The Financial Times. The partnership is part of a broader effort by Apple to strengthen its domestic supply chain and reduce reliance on overseas suppliers, especially amid growing concerns about international trade restrictions.
A new chipmaking technology revealed
Apple announced on Wednesday that it is collaborating with Samsung’s semiconductor facility in Austin, Texas, to introduce what it calls “an innovative new technology for making chips, which has never been used before anywhere in the world.” While Apple did not disclose specifics about the new process, sources told The Financial Times that it will be used to manufacture three-layer stacked image sensors intended for the iPhone 18 series, which is expected to be released in 2026.
Currently, Sony is Apple’s sole supplier of image sensors. These are manufactured in Japan and integrated into Apple’s supply chain through a partnership with Taiwan Semiconductor Manufacturing Company (TSMC). However, Sony does not operate any chipmaking facilities in the United States, making it more vulnerable to upcoming tariffs on semiconductor imports. In contrast, Samsung’s operations in Texas position it as a more strategic partner for Apple under the new trade environment.
A Sony representative responded to the report by stating, “We remain confident that we are advanced in providing sensor technology to our customers, and we will focus on continuing further technological advancement through larger sensor size and density.”
Strategic shift to US-based production
The partnership with Samsung comes as part of Apple’s dramatic expansion of its American Manufacturing Program. The company has pledged to invest a total of US$600 billion into US-based production efforts, a significant increase from the previously committed US$500 billion. This programme aims to localise more of Apple’s supply chain within the United States and support innovation in domestic manufacturing capabilities.
In its official statement, Apple said: “By bringing this technology to the US first, this facility will supply chips that optimise power and performance of Apple products, including iPhone devices shipped all over the world.”
This shift not only helps Apple manage the challenges posed by potential tariffs on foreign-made components but also signals a broader commitment to securing a more resilient and geopolitically stable production pipeline.
Implications for future iPhones
The integration of Samsung’s new three-layer sensor technology is expected to enhance photo and video quality on future iPhone models significantly. The stacked sensor design enables more complex image processing and improved performance in low-light environments. These advancements could position the iPhone 18 lineup as a major step forward in mobile photography.
While Apple has historically worked with multiple suppliers to mitigate risk, its decision to bring Samsung further into its image sensor production pipeline suggests a new level of cooperation between the two technology rivals. However, long-time competitors in the smartphone market, Apple and Samsung, have maintained a complex business relationship, with Samsung already supplying various components for Apple devices.
As both companies prepare for the launch of next-generation iPhones and other consumer electronics, their joint investment in cutting-edge chip manufacturing in the US could mark a pivotal moment in global semiconductor trends.
